Hydrosilex Cutting Compound – Hologram-Free Cut & Polish Formula

Description

Hydrosilex cutting compound is the latest formulation of diminishing abrasives providing a medium cut & polish for hologram-free results. Engineered specifically for use with dual-action or random orbital polishers, the abrasives break down very consistently to produce the highest depth of gloss. Hydrosilex cutting compound is water-based and contains no solvents, silicones, fillers, or petroleum. No dust is produced during polishing which makes for easy cleanup and prolongs the life of the polishing pads.
Recommended Use:
Shake before use. Apply 5-6 drops onto the pad for a 2X2 area. Spread across the working area before turning on the buffer. Maintain a slow tempo and

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